Micro-assembly

The assembly of complex 3D laser targets (e.g. x-ray backlighters and Advanced Fast Ignition cones) requires specific knowledge of the engineering challenges which are faced in the micron regime. The group has extensive expertise in the process of micro-fabrication at the sub-mm level and an understanding of the problems that this poses.

This is essential when manufacturing novel target designs which may require significant technical understanding of the experimental aims and the practical limitations of working in the “micro world”. Full-time micro-assembly engineers work on bespoke jigs to ensure high repeatability of results and ultra precise assembly.

Thin film coating

A dedicated thin-film coating laboratory provides a solid base of coating capabilities which services the production needs for high repetition rate target delivery as well as providing research and development facilities to investigate new target technologies.

Situated in the Target Fabrication Cleanroom a number of complementary techniques including plastic coating, sputtering, thermal evaporation, electron beam deposition, low-density metallic coatings, glancing angle deposition coatings and electroplating and lithography enable the production of filters, multi-layer foil targets and thin foil targets.

Characterisation

An extensive suite of instruments that are specifically geared towards characterisation of high power laser targets are available. The facilities for target characterisation include high specification optical microscopes, a WYKO white light interferometer, an SEM with EDX and surface profiling systems which enable precision measurements on all types of targets.

An AFM and a Confocal microscope are also available in the laboratory. We also offer contract characterisation services for other components; please contact us to discuss your metrology needs.

Micro-engineering

Two HAAS and two KERN CNC micro milling machines provide Scitech Precision with bespoke micro components.

An ongoing programme of development is providing innovative solutions to challenges such as mass production of cones and target supply for high repetition rate laser systems.

MEMS

Scitech Precision has experience in using wafer-based manufacture of MEMS devices, especially high aspect ratio structures to make mass limited targets.

Processing steps can typically include photolithographic or e-beam mask production, deep reactive ion etching and wet processing which allow the production of large numbers of high specification targets for use on high repetition rate lasers.